The DENSYTY® Interconnect System uses proven card edge technology to maximize contact density, performance and usability. The need for high contact density in a small form factor is increasing. New innovative medical devices that require high performance interconnects are being developed every day. AMETEK Engineered Medical Components has developed high-density interconnect solutions that meet customers’ needs and provide those customers with adaptability in an ever-changing market. DENSYTY® interconnect systems can be scaled or modified to fit the needs of many applications, and are tested to meet industry standards, providing confidence in the products connection.
Customizing DENSYTY®:
Understanding that one size does not fit all, AMETEK EMC can customize many design elements to find an optimal solution for a particular product. Those elements include:
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Card Thickness
- Contact count, spacing, pad dimensions
- Plating materials and thicknesses
- Mating spring finger forces
- Card insert/withdrawal forces
- Termination methods
- Mounting of active and passive components
- Flexible circuits
Locking Feature:
- 90 degree
- 45 degree
- 30 degree
- “Push-lock” or “auto-lock”
Mounting
- Panel mounting
- In-line cable
- Custom profile